Asus Prime X670E-PRO WIFI Motherboard

Asus Prime X670E-PRO WIFI Motherboard

About this item

• AMD AM5 socket: Ready for AMD Ryzen 7000 Series desktop processors
• Enhanced power solution: 14plus2 teamed power stages, Pro Cool sockets, alloy chokes and durable capacitors for stable power delivery
• Next-gen connectivity: PCIe 5.0, USB 3.2 Gen 2×2 Type-C, front USB 3.2 Gen 2 Type-C, USB4 header support
• Made for online Gaming: Realtek 2.5 Gb Ethernet, WiFi 6E and LAN Guard
• Two-way AI Noise Cancelation: Reduces background noise from the microphone and audio output for crystal-clear communication in games or video conferences
• Comprehensive cooling: Large VRM heatsinks, M.2 heatsinks, PCIe Slot Q-Release, M.2 Q-Latch, BIOS Flash Back, hybrid fan headers and Fan X pert 4
• Outshine RGB Aura Effect: Stylish edge lighting design, addressable RGB headers and RGB strip header support.

PCIe 5.0 Slot

PCIe 5.0 offers twice the data transfer speed of PCIe 4.0, making it robust enough to handle new data-heavy tasks. PCIe 5.0 also brings other benefits, such as electrical changes to improve signal integrity, backward-compatible CEM connectors for add-in cards, and compatibility with previous versions of PCI Express.

Four M.2 Slots (with PCIe 5.0)
Four M.2 slots support up to the 22110 device and also can provide NVMe SSD RAID for incredible performance potential. Moreover, one M.2 slot supports PCIe 5.0 with data transfer speeds of up to 128 Gbps, enabling quicker operating system boot-up and file management.

*Actual transmission speeds will be lower than the theoretical maximum speed.

M.2 Heatsinks
Three M.2 heatsinks cover four M.2 slots, warding off throttling that can occur with M.2 storage during sustained transfers.

*Removable captive screws reduce risk of drops or loss during heatsink removal.

VRM Heatsink and Thermal Pads

The two VRM heatsinks on PRIME X670E-PRO WIFI are significantly larger than those found on earlier X570 motherboards. Together with the thermal pads, they improve heat transfer from the MOSFETs and chokes for better cooling performance.

Robust Power Design

Stable power is essential to extract every last bit of performance out of AMD processors. The PRIME X670E-PRO WIFI is geared to cater to the demands of these high-core-count CPUs.

1. ProCool Connectors

Proprietary connectors augment the motherboard’s link to the PSU with 8+8 pin connectors that pass 12 volts of power directly to the processors. Each jack features solid pins that can handle more current than hollow-pin connectors.

2. 14+2 Teamed Power Stages

14+2 power stages combine high-side and low-side MOSFETS and drivers into packages rated for 70 amperes each, delivering power, efficiency, stability and performance to latest AMD processors.

USB 3.2 Gen 2×2 Type-C

A batch of USB ports support high-end rigs loaded with peripherals, including both front and rear USB Type-C connectors with ultrafast USB 3.2 Gen 2×2 for transmission speeds of up to 20 Gbps.

WIFI 6E

Onboard WiFi 6E technology takes advantage of the newly available radio spectrum in the 6 GHz band. It provides up to three times the bandwidth of the 5 GHz band and up to seven 160 MHz bands to deliver ultrafast wireless networking speeds and improved capacity as well as better performance in dense wireless environments.

PCIe Slot Q-Release

A physical button located on the chipset heatsink unlocks the first PCIe slot’s security latch with one press, greatly simplifying the process of detaching a PCIe card from the motherboard when it’s time to upgrade to a new GPU or other compatible device.

Q-Latch

The innovative Q-Latch makes it easy to install or remove an M.2 SSD without the need for specific tools. The design employs a simple locking mechanism to secure the drive and neatly eliminate traditional screws.